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F300 Glass Wafer Cutting System

The F300 Glass Disk Cutting Machine combines stationary laser and dual optical systems with a single rotation and glass holding system. This allows for highly accurate cutting with nearly perfect concentricity. 

This machine can be configured to cut many different materials: glass, Crystalline Quartz, Sapphire, Silicon, Silicon on glass, Lithium Niobate, Lithium Tantilate, or many others.

Pricing has been broken down into components to allow users to customize machine capabilities for their specific needs without incurring unnecessary costs.

Requirements beyond those listed below can be quoted on an as needed basis. 

Call our office if you need any assistance determining which capabilities best suit you needs.

F300 Product Capabilities

Maximum Substrate Size
320x320 mm
Glass Thickness (Standard)
0.5 – 1.5 mm
Glass Thickness (Optional Max)
6 mm
Cutting Speed
30 - 150 mm/s
Processing Accuracy
+/- 0.06 mm
Average Edge Roughness (Ra)
< 0.032 um
Scribe Chips

F300 Machine and Facility Specifications.

Laser Equipment (standard)
Sealed CO2 Laser @ 90 W
Machine Length
838 mm
Machine Width
1239 mm
Machine Height
1718 mm (plus 362 mm safety light)
350 kg
Operating Temperature
+18 to +25o C
Relative Humidity
40 - 80% noncondensing
Electrical Requirements
3 x 110/380 V. 50 -60 Hz, 8 kVA.
Clean Dry Air

<20% humidity at 18o +/- 1o C, 8 ATM

Chilled Clean Dry Air

<20% humidity at 4o +/- 1o C, 4 ATM

Chilled Water
18o +/- 1o C
Specifications subject to change without notice.

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Application #164
Process: Silicon Wafer Dicing
Material: Semiconductor Wafers




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