GW500AB: Glass Wafer Dicer

Zero Width Laser Cutting Technology^TM

The GW500AB is the latest generation of precision ZWLCT^TM Laser Glass Wafer Dicing system for IR and CF camera windows, micro displays and other demanding applications.

LASER

• Type Fantom™ sealed CO2 Laser
• Sealed system allows modular replacement

WAFER

• Material: Glass 0.3 -0.5 mm thick.
• Wafer size - 12" max.
• Frame: Standard types (5”, 6”, 8” or 12")
• Holding tape: standard low tack

VISION SYSTEM

• Two-level Magnification 
• Optical zoom
• Type: Pattern Recognition with Automatic Alignment

MOTION SYSTEM

• 4 axis direct drive servo platform.
• Working area 800 x 800 mm
• Maximum axis speed 2000 mm/s

Applications Search:

Total Matching Applications: 140,  Displaying 1 - 3.   Next 3 Applications >>

Application #105 Process: Ceramic Marking Material: Ceramics Application #109 Process: Ceramic Marking Material: Ceramics Application #131 Process: Glass Panel Dicing Material: Glass Panels

Total Matching Applications: 140,  Displaying 1 - 3.   Next 3 Applications >>