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Wafer Dicing and Scribing Systems

Fonon’s basic Wafer Dicing System incorporates Zero Width Laser Dicing Technology™, an innovative method of splitting brittle materials without generating a visible seam. It is a basic method of controlled propagation of Micro-Cracks™.

Benefits of ZWLDT™ Dicing Systems:

Damage-free dicing of thin silicon
Capable of producing smallest street widths which, in return, provide additional space for more parts per wafer
Single step process results in reduction of cost and processing time per wafer
Capable of producing multiple size die on the same wafer
Capable of dicing complex shapes
Cuts each die individually, regardless of shape, size, or position
Capable of cutting wafers on a tape frame
Dry process eliminates the use of water and additional handling steps