Material Process: Glass Wafers

Glass Wafer Dicing Glass Wafers Application #142

Process: Glass Wafer Dicing
Material: Glass Wafers
Industry: FPD

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Application Details:

Precision fabrication of Glass Wafers is possible on GW500. It produces a smooth, stress free, flawless edge without any material loss, edge chipping and without any further edge treatment.

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Highlighted Application:

Application #184
Process: Cutting & Scribing
Material: TFT LCD

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