Fonon DSS invites you to SemiCon West

Join Fonon Display and Semiconductor Systems (DSS) at Semicon West in San Francisco this July 17-19 in the Moscone Center. Hear about the latest developments in semiconductors, MEMS, renewable energy applications, semiconductor testing, advanced packaging, wafer processing and more from the industry's leading technologists.

Fonon DSS will be showcasing the FL 600, an ITO removal system,and the BlackStar™, patented technology for wafer dicing.

	BlackStar™ is a zero width laser dicing system serving as an alternative to mechanical saws too damaging and costly for cutting of thin delicate silicon, low-K, and complex material wafers.
The FL600 is capable of direct fiber laser patterning on indium tin oxide (ITO), TCO, TO, anti-reflective coatings on glass and PET plastic film.

Contact us to learn more about our systems or send us your samples and we will process them and send you a report free of charge. We hope to see you in San Francisco!

Fonon DSS, is a division of Fonon Technology International, the world renowned inventor and manufacturer of Zero Width Laser Cutting Technology^TM. Fonon DSS focuses on the semiconductor and flat panel display industries utilizing the patented Zero Width Laser Cutting Technology^TM (ZWLCT^TM) to create products with the highest level of precision.